Cooling unit having a dew point monitor

ABSTRACT

A cooling unit includes a fluid circuit through which coolant fluid is pumped. A portion of the fluid circuit is positioned within a space through which air flows. A sensor is positioned within the space. The sensor determines an ambient dew point of the air in the space. A parameter adjuster adjusts a parameter of the coolant fluid in the fluid circuit based on the ambient dew point in the space.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application relates to and claims priority from PCT Application Serial No. PCT/GB2010/000658 titled “Cooling Unit” filed Apr. 1, 2010 which claims priority to GB 0905871.0 titled “Cooling Unit” filed Apr. 3, 2009, the complete subject matter of which is hereby expressly incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

The subject matter described herein relates to a cooling unit and, more particularly, to a cooling unit having sensors to monitor an ambient dew point of a space to be cooled by the cooling unit.

Typically, cooling units for electronic equipment include a primary and a secondary circuit through which coolant fluid is pumped when the unit is in use. Portions of the primary and secondary circuits are thermally coupled to one another to form a primary heat exchanger. The primary heat exchanger conditions the coolant fluid in the secondary circuit. The coolant fluid in the secondary circuit is passed to a secondary heat exchanger positioned in the space which is to be cooled. The cooling fluid in the secondary heat exchanger cools the air flowing through the space.

However, conventional cooling units are not without their disadvantages. Generally, cooling units are not readily adapted to cope with a change in the ambient dew point of the air in the space to be cooled. If the ambient dew point changes, condensation may occur on surfaces carrying the cooling medium such as pipes or heat exchangers within the space to be cooled. Condensation may put the operation of electronic equipment or other equipment within the space to be cooled at risk. Particularly where the heat exchanger is in close proximity to the equipment to be cooled such as in IT, CPU or server cooling applications, direct or indirect.

A need remains for a cooling unit that monitors the ambient dew point of the space to be cooled by the cooling unit and adjusts a temperature of the coolant fluid in the secondary circuit accordingly.

SUMMARY OF THE INVENTION

In one embodiment, a cooling unit is provided. The cooling unit includes a primary heat exchanger. A primary circuit is provided through which coolant fluid is pumped. A portion of the primary circuit flows through the primary heat exchanger. A secondary circuit is provided through which coolant fluid is pumped. The coolant fluid in the secondary circuit conditions air within a space or directly cools a component or heat source such as a CPU. A portion of the secondary circuit flows through the primary heat exchanger. The portions of the primary and secondary circuit flowing through the primary heat exchanger are thermally coupled so that the coolant fluid in the primary circuit conditions the coolant fluid in the secondary circuit. A sensor is positioned within the space. The sensor determines an ambient dew point of the space. A parameter adjuster is positioned in the primary circuit. The parameter adjuster adjusts a parameter of the coolant in the primary circuit based on the ambient dew point in the space. Altering a parameter of the coolant fluid in the primary circuit alters a parameter of the coolant fluid in the secondary circuit to reduce condensation within the space.

In another embodiment, a method of cooling air in a space is provided. The method includes pumping coolant fluid through primary and secondary circuits having respective portions thermally coupled within a primary heat exchanger so that the coolant fluid in the primary circuit conditions the coolant fluid in the secondary circuit. The coolant fluid in the secondary circuit is distributed to at least one secondary heat exchanger positioned with a space. An ambient dew point of the space is monitored with a sensor. A parameter of coolant fluid in the primary circuit is adjusted based on the ambient dew point to reduce condensation in the space.

In another embodiment, a cooling unit is provided. The cooling unit includes a fluid circuit through which coolant fluid is pumped. A portion of the fluid circuit is positioned within a space through which air flows. A sensor is positioned within the space. The sensor determines an ambient dew point of the air in the space. A parameter adjuster adjusts a parameter of the coolant fluid in the fluid circuit based on the ambient dew point in the space.

In another embodiment, a method of cooling air in a space is provided. The method includes channeling the air through a space and pumping coolant fluid through a fluid circuit flowing through the space. An ambient dew point of the air in the space is monitored with a sensor. A parameter of the coolant fluid in the fluid circuit is controlled based on the ambient dew point to reduce condensation in the space.

In one embodiment, a cooling unit is provided with a temperature and humidity sensor connected to a control processor of the unit. The temperature and humidity sensors are located in a space which is to be cooled. The sensors enable the control processor to determine the ambient dew point of the space. The control processor controls an operation of the unit based on the ambient dew point of the space. The unit includes a parameter adjuster in the primary circuit of the cooling unit. The parameter adjuster enables the control processor to control operation of the unit based on the ambient dew point by adjusting a parameter of the coolant in the primary circuit thereby altering a parameter of the coolant in a secondary circuit of the cooling unit. Adjusting a parameter of the coolant in the secondary circuit reduces condensation in the space when the unit is in use. The parameter adjuster may be a variable control valve or a variable pump that varies the flow rate of coolant fluid in the primary circuit to change a temperature of the coolant fluid in the secondary circuit. Alternatively, the parameter adjuster may be a temperature adjuster. In one embodiment, the cooling unit reduces a risk of condensation while maintaining the passage of the coolant through the space.

In the present specification hereinafter the word “deceeds” shall be taken to mean the opposite of “exceeds”. For example, if a parameter is below a given threshold, or falls below a given threshold, it may be considered that that parameter “deceeds” that threshold. The usual grammatical and syntactical principles shall be taken to apply to that word.

At least one temperature sensor may be provided to give an indication of the temperature of the coolant in the secondary circuit. The temperature sensor is connected to the control processor to enable the control processor to adjust the parameter adjuster in the primary circuit to ensure that an amount by which the temperature of the coolant in the secondary circuit exceeds the ambient dew point does not deceed a predetermined threshold value.

The unit may include at least one selectively adjustable variable control valve or variable pump in the secondary circuit to enable the amount of fluid which passes through the secondary circuit to be selectively adjusted.

In one embodiment, the coolant which passes through the secondary circuit of the cooling unit is passed to a secondary heat exchanger associated with heat-generating electronic equipment within the space. The space occupied by the equipment may be a data center, a telecoms center or room, an IT center or room, a data storage equipment center or room, and/or another room or space containing electronic equipment. The space may include a chassis having a frame that holds equipment. The equipment may include one or more server racks or other types of electronic equipment. The frame of the chassis defines an enclosure that at least partially surrounds the equipment. The frame retains one or both of the primary and secondary circuits proximate to the equipment within the frame of the chassis. For example, the primary and secondary circuits are retained in a position that enables the primary and secondary circuits to provide cooling to the equipment within the chassis.

The equipment may include multiple server racks, blade server racks and/or other pieces of equipment, for example, chassis or enclosures for mounting IT equipment or other equipment in the data center. The cooling unit may be a cooling distribution unit. The coolant fluid which passes through the secondary circuit may be distributed to multiple secondary heat exchangers respectively associated with the server racks, blade server racks and/or other pieces of equipment, for example, chassis or enclosures for mounting IT equipment or other equipment.

In one embodiment, the secondary circuit of the cooling unit is part of a coolant circuit including a common upstream header that extends to respective locations adjacent to the equipment racks or other equipment. The secondary circuit is provided with outlets connected to inlets of the secondary heat exchangers. A common downstream header is provided with inlets connected to outlets of the secondary heat exchangers.

In one embodiment, each outlet from the common upstream header is provided with a selectively adjustable variable control valve to enable adjustment of fluid flow to and from a given equipment rack or other piece of equipment.

In another embodiment, the unit is provided with a frame which supports the primary and secondary circuits. An outlet manifold is provided from the secondary circuit and an inlet manifold is provided to the secondary circuit. The cooling distribution unit can be installed at the time the data center, other equipment room and/or space is being constructed. Alternatively, the cooling distribution unit may be used for retro fitting an existing center, room and/or space.

The connections to the inlets and the outlets may be by way of quick release connectors, for example bayonet connectors. Each connection between an inlet or an outlet and a respective heat exchanger associated with an equipment rack or other piece of equipment may be by way of a flexible hose having respective quick release connectors at its two ends. This provides for ease of installation.

The embodiments extend to a method of cooling the air in a data center or other center, room or space using a cooling unit in accordance with the embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a first side perspective view of a cooling distribution unit formed in accordance with an embodiment.

FIG. 2 illustrates a second side perspective view of the unit shown in FIG. 1.

FIG. 2 a illustrates an exploded view of an embodiment of the unit shown in FIGS. 1 and 2.

FIG. 2 b illustrates an exploded view of another embodiment of the unit shown in FIGS. 1 and 2.

FIG. 3 illustrates a first perspective view of a data center including a cooling distribution unit as shown in FIGS. 1 and 2.

FIG. 4 illustrates a schematic view of a fluid circuit and an electronic circuit of the cooling distribution unit shown in FIGS. 1, 2 and 3.

DETAILED DESCRIPTION OF THE DRAWINGS

The foregoing summary, as well as the following detailed description of certain embodiments will be better understood when read in conjunction with the appended drawings. As used herein, an element or step recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to “one embodiment” are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising” or “having” an element or a plurality of elements having a particular property may include additional such elements not having that property.

The cooling distribution unit 10 shown in FIGS. 1 and 2 includes a metal frame 12 enclosed in sheet metal paneling 14 (shown in FIG. 3). The frame 12 supports a primary circuit inlet 16 (shown in FIG. 2) and a primary circuit outlet 18 (shown in FIG. 2) connected via respective isolation valves 20 and 22 (shown in FIG. 2) to a primary heat exchanger 24 (shown in FIG. 2) via a primary circuit 26 (shown in FIG. 2). In one embodiment, the primary heat exchanger 24 may be a plate heat exchanger. Alternatively, the primary heat exchanger 24 may be any suitable heat exchanger. The primary circuit 26 includes portions of the primary heat exchanger 24. The primary circuit inlet 16 is connected to the primary heat exchanger 24 via an optional filter 28 (shown in FIG. 2). An optional bypass circuit 30 (shown in FIG. 2) having a shut-off valve 34 (shown in FIG. 2) interconnects the primary circuit inlet 16 and the primary circuit outlet 18 downstream and upstream, respectively, of the isolation valves 20 and 22. The bypass circuit 30 bypasses the heat exchanger 24. The valves 20 and 22 may be two-way valves in one embodiment. Alternatively, a single three-way valve may be used in place of the valves 20 and 22. The primary circuit outlet 18 is connected to the primary heat exchanger 24 via primary circuit variable control valves 36 (shown in FIG. 1) connected in parallel with one another. In one embodiment, a single three-way variable control valve 36 may replace multiple control valves 36. In an embodiment using multiple valves 36, one valve 36 acts as a standby for the other valve 36 via a primary circuit flowmeter 38.

The unit 10 is provided with a secondary circuit inlet 40 (shown in FIG. 2) and a secondary circuit outlet 42 (shown in FIG. 2) connected to the primary heat exchanger 24 via a secondary circuit 43 (shown in FIG. 2). The secondary circuit 43 includes portions of the primary heat exchanger 24. The inlet 40 is connected via an optional secondary circuit filter 44 (shown in FIG. 2) to the primary heat exchanger 24. The secondary circuit outlet 42 is connected to the primary heat exchanger 24 via run and standby secondary variable control pumps 46 (shown in FIG. 1) which are in parallel with one another, and an optional secondary circuit reservoir tank 48 (shown in FIG. 1) provided with a level switch 50 (shown in FIG. 1). In one embodiment, the reservoir tank 48 may be replaced with an out of circuit expansion tank (not shown).

The control valves 36, the flowmeter 38, the secondary circuit pumps 46, and the level switch 50 are all electronically connected to a control and display unit 52.

The secondary circuit inlet 40 and the secondary circuit outlet 42, respectively, may be connected to respective flexible tailpipes 54 (shown in FIG. 2 a) that extend downward to respective under-floor manifolds. Alternatively, the secondary circuit inlet 40 and the secondary circuit outlet 42 may be connected directly to respective manifolds 56 and 58, as shown in FIG. 2 b. The manifolds 56 and 58 have respective common chambers 60 and 62 and respective sets of inlets 64 and outlets 66. The inlets 62 and the outlets 66 may include quick release couplings. The outlets 66 of the secondary circuit outlet 42 are provided with respective control valves 68.

FIG. 3 shows a space 100 to be occupied by equipment. The space 100 may be a data center, a telecoms center or room, an IT center or room, a data storage equipment center or room, and/or another room or space containing electronic equipment. The space 100 may include a chassis having a frame that holds equipment. The equipment may include one or more server racks or other types of electronic equipment. The frame of the chassis defines an enclosure that at least partially surrounds the equipment. The frame retains one or both of the primary and secondary circuits proximate to the equipment within the frame of the chassis. The equipment may include a multiple server racks, blade server racks and/or other pieces of equipment, for example, chassis or enclosures for mounting IT equipment or other equipment in the data center.

The space 100 is provided with a chiller unit 110 to supply cooled water to perimeter cooling 120. The chiller unit 110 may also provide cooled water to the primary circuit 26 of the cooling distribution unit 10. The cooling distribution unit 10 is provided with flexible tailpipes 54 (shown in FIG. 2 a) extending under raised flooring 130 of the data center 100. The cooling distribution unit 10 is provided with manifolds similar to the manifolds 56 and 58 shown in FIG. 2 b. The manifolds 56 and 58 are connected to the ends of the flexible tailpipes 54 and may be positioned remotely from the cooling distribution unit 10.

In the illustrated embodiment, the space 100 is provided with rows of equipment racks 140. The equipment racks 140 may be blade server racks or the like. The equipment racks 140 are provided with secondary heat exchangers 142. In one embodiment, the secondary heat exchangers 142 may be rear door heat exchangers that are coupled to a rear door of the equipment rack 140. The space 100 may include any number of secondary heat exchangers 142. Each of the secondary heat exchangers 142 is connected to the secondary circuit 43 of the cooling distribution unit 10 via respective outlets 66 and inlets 64.

The fluid and electrical circuitry of the cooling distribution unit 10 shown in FIGS. 1 to 3 is shown more clearly in FIG. 4 in which parts corresponding to what is shown in FIGS. 1 and 2 are given the same reference numerals as in FIGS. 1 and 2.

Additional components of the cooling distribution unit 10, more readily apparent from FIG. 4, include a speed controller 200 electrically connected between the control and display unit 52 and the pumps 46. Pressure meters 202, 204, 206 and 208 are connected to the control and display unit 52 and are located to measure the pressure of the coolant flowing immediately upstream and downstream, respectively, of the pumps 46 and upstream and downstream, respectively, of the filter 28. Thermometers 210, 212, 214 are also connected electrically to the control and display unit 52 and are located to provide a measure of the temperature of coolant flowing immediately upstream of the filter 28 and a temperature of coolant flowing at locations downstream of the optional secondary circuit reservoir tank 48 but upstream of the pumps 46.

An air eliminator 216 is provided downstream of the secondary circuit inlet 40. An air eliminator 218 is provided in the reservoir tank 48. A filling pump 250 is provided to pump cooling fluid from a source 252 into the reservoir tank 48.

A thermometer and/or other temperature sensor 260 is located in the space 100. The temperature sensor 260 is connected to the control and display unit 52. A humidity sensor 262 is connected to the control and display unit 52. The humidity sensor 262 is located in the space 100.

With the cooling distribution unit 10 and other apparatus connected as shown in FIGS. 3 and 4, the equipment operates as follows. The chiller 110 provides cool water for the primary circuit 26 of the cooling distribution unit 10. The cool water flows through the primary circuit inlet 16. Flow of the cool water may be controlled by a valve 20. The cool water passes through the filter 28. Alternatively, the filter may not be fitted or may be fitted or may be external to the unit. The water may be directed through the by-pass 30 to by-pass the primary heat exchanger 24. The cool water is heated in the primary heat exchanger 24 by hot water in the secondary circuit 43 flowing through the primary heat exchanger 24. The heated water exits the heat exchanger 24 and passes through a control valve 36 and flowmeter 38. The flowmeter 38 monitors a flow of the water from the primary heat exchanger 24 in the primary circuit 26. The control valve 36 may be adjusted to control the flow of water from the primary heat exchanger 24. After exiting the primary heat exchanger 24, the heated water returns to the chiller 110 via the primary outlet 18. The flow of water to the chiller 110 may be adjusted by the valve 22. With a three way valve the primary “chiller” flow is constant but the amount flowing through the heat exchanger or bypassing will vary according to the demand. The heated water is cooled by the chiller 110 and returned to the primary circuit inlet 16.

With respect to the secondary circuit 43, one of the pumps 46 supplies cool water from the reservoir tank 48 to the output 42 of the unit 10. In the event that the liquid level in the reservoir tank 48 as sensed by the level switch 50 deceeds a predetermined threshold level stored in the control and display unit 52, the tank is replenished by water from the source 252 via the pump 250. The pumps 46 supply water to the secondary heat exchangers 142 via respective outlets of the manifold 58. The water in the secondary heat exchangers 142 is utilized to cool heated air flowing through the equipment racks 140 (shown in FIG. 3). The flow control valve 68 and the speed of the pump 46 may be adjusted to control a flow of cooled water through the secondary heat exchangers 142. The secondary heat exchangers 142 produce heated water as the hot air in the equipment racks 140 is cooled.

The heated water from the secondary heat exchangers 142 is returned via piping (not shown) to the input 40 of the cooling distribution unit 10. The heated water flows through the secondary circuit 43. The heated water may flow through a filter 44. Optionally, the filter may not be fitted or may be external to the unit. The heated water is returned to the primary heat exchanger 24 where the heated water is cooled by the cool water in the primary circuit 26 flowing through the primary heat exchanger 24.

The control and display unit 52 monitors the temperature and the humidity of the space 100 with the temperature sensor 260 and the humidity sensor 262. In one embodiment, the temperature and humidity are continuously monitored throughout the operation of the unit 10. The temperature sensor 260 and the humidity sensor 262 send a signal to the control and display unit 52 that is indicative of the temperature and humidity of the space 100. In one embodiment, the temperature sensor 260 and the humidity sensor 262 are positioned within the space 100 remotely from the equipment racks 140. For example, the temperature sensor 260 and the humidity sensor 262 may be positioned along a ceiling of the space 100, along the floor of the space 100 and/or at any intermediate location between the ceiling and floor of the space 100. Alternatively, the temperature sensor 260 and the humidity sensor 262 may be positioned within the equipment racks 140. In one embodiment, multiple temperature sensors 260 and humidity sensors 262 are positioned throughout the space 100 and/or the equipment racks 140.

The control and display unit 52 determines the dew point in the space 100 based on the humidity measurements from the humidity sensor 262. In one embodiment, the dew point is determined assuming a pressure of substantially one atmosphere for the air in the space 100. The temperature of air in the space 100 is monitored by the control and display unit 52 with the temperature sensor 260. The temperature of the cool water immediately downstream of the secondary circuit reservoir tank 48 is monitored with at least one of the thermometers 212 or 214. A signal indicative of the temperature of the water downstream of the reservoir tank 48 is delivered to the control and display unit 52. The control and display unit 52 determine a temperature difference between the temperature at thermometer 212 or 214 and the ambient dew point. In one embodiment, the temperature at the thermometer 212 or 214 is configured to be 1° C. to 5° C. degrees greater than the ambient dew point of the space. In one embodiment, the temperature at the thermometer 212 or 214 is configured to be maintained at least 2° C. degrees greater than the ambient dew point. In the event that a temperature difference between the temperature at thermometer 212 or 214 and the ambient dew point deceeds a predetermined safe threshold value, the control valves 36 in the primary circuit 26 are partially closed by the control and display unit 52. In one embodiment, the predetermined safe threshold value may be within a range of 1° C. to 5° C. Closing the control valves 36 decreases and amount of cool water flowing through the primary circuit within the primary heat exchanger 24, thereby raising the temperature of the water in the secondary circuit 43. Raising the temperature of the water in the secondary circuit 43 increases the temperature difference between the water downstream of the reservoir tank 48 and the ambient dew point in the space 100 so that the temperature of the coolant fluid in the secondary circuit 43 exceeds the predetermined safe threshold value. Controlling the temperature of the coolant fluid in the secondary circuit reduces a likelihood of condensation in the secondary heat exchangers 142, while maintaining an adequate cooling effect of the air in the space 100.

In one embodiment, the control and display unit 52 may be provided with an input from a pressure sensor 261 located within the space 100. The pressure sensor 261 may be located remotely from the equipment racks 140 within the space 100 and/or positioned within at least one of the equipment racks 140. The pressure sensor 261 may continuously monitor the pressure of the air in the space 100 while the unit 10 is in use. The control and display unit 52 may be programmed to calculate the dew point in the space 100 based on the inputs from both the humidity sensor 262 and the pressure sensor 261. In another embodiment, an atmospheric pressure sensor (e.g., a barometer) may be added to directly measure the pressure in the closed environment of the space 100. Measurements from the atmospheric pressure sensor and from the humidity sensor 262 may be provided to the control and display unit 52 to calculate the dew point based on the humidity and pressure of the air in the closed environment.

In one embodiment, the control valves 36 may be replaced or supplemented by control pumps. The control pumps 46 may be supplemented by control valves or replaced by control valves if, for example, a single pump is provided in a non-branched part of the secondary passageway 43.

In one embodiment, the cooling distribution unit 10 can be installed at the time the space 100 is being constructed. Alternatively, the cooling distribution unit 10 may be used for retro fitting an existing space 100.

Numerous variations and modifications to the illustrated cooling distribution unit may occur to a reader of the specification without taking the unit outside the scope of the embodiments.

It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the various embodiments of the invention without departing from their scope. While the dimensions and types of materials described herein are intended to define the parameters of the various embodiments of the invention, the embodiments are by no means limiting and are exemplary embodiments. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the various embodiments of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.

This written description uses examples to disclose the various embodiments of the invention, including the best mode, and also to enable any person skilled in the art to practice the various embodiments of the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the various embodiments of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if the examples have structural elements that do not differ from the literal language of the claims, or if the examples include equivalent structural elements with insubstantial differences from the literal languages of the claims. 

1. A cooling unit comprising: a primary heat exchanger; a primary circuit through which coolant fluid is pumped, a portion of the primary circuit flowing through the primary heat exchanger; a secondary circuit through which coolant fluid is pumped, the coolant fluid in the secondary circuit conditioning air within a space, a portion of the secondary circuit flowing through the primary heat exchanger, the portions of the primary and secondary circuit flowing through the primary heat exchanger being thermally coupled so that the coolant fluid in the primary circuit conditions the coolant fluid in the secondary circuit; a sensor positioned within the space, the sensor determining an ambient dew point of the space; and a parameter adjuster positioned in the primary circuit, the parameter adjuster adjusting a parameter of the coolant in the primary circuit based on the ambient dew point in the space, wherein altering a parameter of the coolant fluid in the primary circuit alters a parameter of the coolant fluid in the secondary circuit to reduce condensation within the space.
 2. The cooling unit of claim 1, wherein a flow rate of coolant fluid in the primary circuit is adjusted.
 3. The cooling unit of claim 1, wherein the temperature of coolant fluid in the secondary circuit is altered to reduce condensation within the space.
 4. The cooling unit of claim 1, wherein the parameter adjuster includes at least one of a variable control valve or a variable pump to control the flow rate of coolant fluid in the primary circuit.
 5. The cooling unit of claim 1, wherein the sensor determines a temperature of the air in the space.
 6. The cooling unit of claim 1, wherein the sensor determines a humidity of the air in the space to determine the ambient dew point.
 7. The cooling unit of claim 1, wherein the sensor determines a pressure of the air in the space to determine the ambient dew point.
 8. The cooling unit of claim 1 further comprising a temperature sensor to determine a temperature of the coolant fluid in the secondary circuit, the temperature of the coolant fluid in the secondary circuit compared to the ambient dew point of the space.
 9. The cooling unit of claim 1 further comprising at least one of an adjustable variable control valve or a variable pump in the secondary circuit to adjust an amount of coolant fluid which passes through the secondary circuit.
 10. The cooling unit of claim 1, wherein the secondary circuit is coupled to an upstream header having outlets connected to secondary heat exchangers positioned within the space, and a downstream header having inlets connected to the secondary heat exchangers.
 11. The cooling unit of claim 1 further comprising an upstream header coupled to the secondary circuit and having a control valve to adjust a flow of fluid into a secondary heat exchanger positioned within the space.
 12. The cooling unit of claim 1, wherein the secondary circuit includes inlets and outlets having quick release connectors.
 13. The cooling unit of claim 1, wherein the secondary circuit includes inlets and outlets having bayonet connectors.
 14. The cooling unit of claim 1, wherein the secondary circuit is coupled to a secondary heat exchanger with flexible hoses.
 15. The cooling unit of claim 1 further comprising a frame to support the first and secondary circuits.
 16. The cooling unit of claim 1, wherein the space includes heat-generating electronic equipment which is to be cooled.
 17. A method of cooling air in a space, the method comprising: pumping coolant fluid through primary and secondary circuits having respective portions thermally coupled within a primary heat exchanger so that the coolant fluid in the primary circuit conditions the coolant fluid in the secondary circuit; distributing the coolant fluid in the secondary circuit to at least one secondary heat exchanger positioned with a space; monitoring an ambient dew point of the space with a sensor; and controlling a parameter of coolant fluid in the primary circuit based on the ambient dew point to reduce condensation in the space.
 18. The method of claim 17, wherein controlling a parameter of coolant fluid in the primary circuit includes controlling a flow rate of the coolant fluid in the primary circuit.
 19. The method of claim 17, wherein the parameter of the coolant fluid in the primary circuit is adjusted to alter a temperature of the coolant fluid in the secondary circuit.
 20. The method of claim 17 further comprising monitoring a temperature of the air in the space.
 21. The method of claim 18 further comprising monitoring a humidity of the air in the space to determine the ambient dew point of the air in the space.
 22. The method of claim 19 further comprising monitoring a pressure of the air in the space to determine the ambient dew point of the air in the space.
 23. The method of claim 19 further comprising: monitoring a temperature of the coolant fluid in the secondary circuit; and comparing the temperature of the coolant fluid in the secondary circuit to the ambient dew point of the space.
 24. A cooling unit comprising: a fluid circuit through which coolant fluid is pumped, a portion of the fluid circuit positioned within a space through which air flows; a sensor positioned within the space, the sensor determining an ambient dew point of the air in the space; and a parameter adjuster to adjust a parameter of the coolant fluid in the fluid circuit based on the ambient dew point in the space.
 25. The cooling unit of claim 24, wherein the parameter adjuster adjusts a temperature of the coolant fluid in the fluid circuit.
 26. The cooling unit of claim 24, wherein the space includes heat-generating electronic equipment which is to be cooled.
 27. The cooling unit of claim 24, wherein the sensor determines a temperature of the air in the space.
 28. The cooling unit of claim 24, wherein the sensor determines a humidity of the air in the space to determine the ambient dew point of the space.
 29. The cooling unit of claim 24, wherein the sensor determines a pressure of the air in the space to determine the ambient dew point of the space.
 30. The cooling unit of claim 24 further comprising a sensor to determine a temperature of the coolant in the fluid circuit, the temperature of the coolant in the fluid circuit compared to the ambient dew point of the space.
 31. A method of cooling air in a space, the method comprising: channeling the air through a space; pumping coolant fluid through a fluid circuit flowing through the space; monitoring an ambient dew point of the air in the space with a sensor; and controlling a parameter of the coolant fluid in the fluid circuit based on the ambient dew point to reduce condensation in the space.
 32. The method of claim 31, wherein controlling a parameter of the coolant fluid includes controlling a temperature of the coolant fluid.
 33. The method of claim 31 further comprising monitoring a temperature of the air in the space.
 34. The method of claim 31 further comprising monitoring a humidity of the air in the space to determine the ambient dew point of the air in the space.
 35. The method of claim 31 further comprising monitoring a pressure of the air in the space to determine the ambient dew point of the air in the space.
 36. The method of claim 31 further comprising: monitoring a temperature of the coolant fluid in the fluid passageway; and comparing the temperature of the coolant fluid in the fluid passageway to the ambient dew point of the space. 